发明名称 |
Securing device for assembling heat dissipation module onto electronic component |
摘要 |
A securing device (30) is used for securing a heat sink (10) to a printed circuit board (40) with a heat-generating electronic component (41) mounted thereon. The securing device includes a V-shaped elongated main body (31), a first locking leg (34), a second locking leg (332) and a resilient member (32). The first locking leg and second locking leg are connected to two opposite ends of the main body respectively for engaging with a retention frame (20) on the printed circuit board. The resilient member includes a planar-shaped supporting plate (321) engaging with a bottom portion of the main body and at least one resilient foot (322) extending downwardly from the supporting plate. The resilient foot deforms to exert a resilient force on the heat sink when the heat sink is assembled to the electronic component by the securing device.
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申请公布号 |
US7746646(B2) |
申请公布日期 |
2010.06.29 |
申请号 |
US20080256462 |
申请日期 |
2008.10.22 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
KUO JER-HAUR;ZHA XIN-XIANG;YU YE-FEI;YANG LIN;YU FANG-XIANG |
分类号 |
H05K7/20;H01L23/40 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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