| 摘要 |
A polishing device for polishing the circumferential portion (bevel portion, notch portion, edge cut portion) of a substrate (W) by sliding a polishing tool (41) on the circumferential portion.The polishing device comprises a substrate-holding portion for holding the substrate (W), and a polishing head for polishing the circumferential portion of the substrate (W) held by the substrate-holding portion by using the polishing tool (41). The polishing head has a press pad (50) for pressing the polishing tool (41) against the circumferential portion of the substrate (W), and a linear motor (90) for moving the press pad (50) reciprocally.
|
