发明名称 |
Light emitting device and method of manufacturing method thereof and thin film forming apparatus |
摘要 |
A method of manufacturing a light emitting device of upward emission type and a thin film forming apparatus used in the method are provided. A plurality of film forming chambers are connected to a first transferring chamber. The plural film forming chambers include a metal material evaporation chamber, an EL layer forming chamber, a sputtering chamber, a CVD chamber, and a sealing chamber. By using this thin film forming apparatus, an upward emission type EL element can be fabricated without exposing the element to the outside air. As a result, a highly reliable light emitting device is obtained.
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申请公布号 |
US7744949(B2) |
申请公布日期 |
2010.06.29 |
申请号 |
US20080327871 |
申请日期 |
2008.12.04 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
KONUMA TOSHIMITSU;YAMAZAKI HIROKO |
分类号 |
B05D5/06;B05D1/32;C23C14/00;C23C16/00;H01L27/32;H01L51/56 |
主分类号 |
B05D5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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