发明名称 Thin film capacitor and capacitor-embedded printed circuit board
摘要 <p>There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.</p>
申请公布号 KR100967056(B1) 申请公布日期 2010.06.29
申请号 KR20070030876 申请日期 2007.03.29
申请人 发明人
分类号 H01G4/06 主分类号 H01G4/06
代理机构 代理人
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