METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A manufacturing method and a manufacturing device thereof are provided to improve the uniformity of a thin film deposition process by minimizing the contact area between a preheated substrate and a susceptor. CONSTITUTION: A substrate is loaded in a preheated chamber(S100). The temperature of the substrate is preheated in order to have higher temperature than the temperature of a preset thin film deposition process(S110). The preheated substrate is settled in the susceptor of a processing chamber(S120). The thin film deposition process using a chemistry deposition method is executed in the processing chamber(S130). The substrate in which the thin film is formed is unloaded to the outside in the processing chamber(S140). In a surface processing chamber, a thin film surface processing process is executed(S150).