发明名称 LAMP UNIT, CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To prevent deterioration of an LED and peripheral components at a low cost by making the heat generated by the LED conduct efficiently to the outside. <P>SOLUTION: The lamp has a case having a high thermal conductivity and a wiring board 30, which is tightly adhered to the case 11 and on the board an LED element 60 is mounted on the case 11. The board 30 is provided with an insulating layer 40, a first copper layer 50 which is arranged in lamination on the lower face 41 side of the insulating layer 40 and forms a heat conducting portion, and a second copper layer 70, which is arranged in lamination on the upper face 42 side of the insulating layer 40 and on which a wiring pattern 71 to be connected to the LED element 60 is formed. The insulating layer 40 has the first copper layer 50, exposed directed toward the lower face 42 side and an opening portion 43, which is arranged by jointing the bottom face 61 of the LED element 60 to the first copper layer 50. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010140820(A) 申请公布日期 2010.06.24
申请号 JP20080317573 申请日期 2008.12.12
申请人 TOSHIBA CORP 发明人 HAPPOYA AKIHIKO
分类号 F21S2/00;F21Y101/02;H05K1/02;H05K1/05 主分类号 F21S2/00
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