| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To downsize a semiconductor device by arranging a plurality of terminals for external connection in a surface of a wiring board. <P>SOLUTION: This semiconductor device includes: a package board 4 having an optical communication IC mounted thereon, and including a micro-strip line 4g having surface layer wiring 4c for a signal and a GND layer 4f; a high-frequency semiconductor chip 2 mounted on a principal surface 4a of the package board 4 by flip chip connection; a coaxial cable 7 with a core 7a electrically connected to the surface layer wiring 4c for a signal; an underfill resin 6 for protecting the flip chip connection part of the semiconductor chip 2; a plurality of ball electrodes 3 arranged in the back face 4b of the package board 4; and a coaxial connector 11 arranged on a frame member 8 attached to the package board 4. The semiconductor device includes a structure capable of transmitting a high-frequency signal from the coaxial cable 7 to all the surface layer of the package board 4 only by the micro-strip line, and allows the package to be downsized by arranging the plurality of ball electrodes 3 in an array-like form on the back face 4b of the package board 4. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
