| 摘要 |
Seal-bonding properties and reliability of an electronic device are improved by increasing bonding strength to a glass substrate with good reproducibility during laser seal-bonding. A glass substrate (3) has a sealing region. The sealing region is provided with a seal-bonding material layer (5) that is a fired layer of a seal-bonding glass material containing a seal-bonding glass, a low expansion filler and a laser absorbent. The seal-bonding glass contains, on a mass basis, 20-68% of SnO, 0.5-5% of SnO2 and 20-40% of P2O5. The seal-bonding material layer (5) has a residual carbon content of 20-1,000 ppm on a mass basis. The glass substrate (3) and a glass substrate (2) having an element formation region that is provided with an electronic element are stacked together, and the seal-bonding material layer (5) is melted by irradiation of laser light (6), so that the substrates (2, 3) are seal-bonded with each other. |
