| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which incorporates a fuse for trimming an internal circuit, the semiconductor device having a reduced layout area including signal wiring for connecting the trimmed internal circuit to the fuse. Ž<P>SOLUTION: The semiconductor device includes a semiconductor substrate, an interlayer dielectric of at least one layer formed on the semiconductor substrate, and a fuse block including a plurality of fuses and multiple return wiring formed in a wiring layer on the interlayer dielectric of the at least one layer, and in the fuse block, two fuses provided adjacently at a first interval and two pieces of return wiring provided adjacently at a second interval smaller than the first interval are alternately arranged. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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