| 摘要 |
The invention provides a cavity-containing package (1 ) for a MEMS device (17) comprising a first substrate (3) having a surface (4) facing the cavity (15), a second substrate (5) having a surface (6) facing the cavity (15) and a loop of composite material (7), the loop having a surface (8) facing the cavity (15), a surface (10) facing away from the cavity (15) and two substrate-abutting surfaces (12, 14) and comprising a layer of polymeric material (11, 13, 29) and a layer of metal (9, 99) each of which layers' edges face the cavity-facing surfaces (4, 6) of the substrates, said cavity-facing surfaces (4, 6) of the substrates (3, 5) being connected to each other by said loop of composite material (7), wherein the substrate-abutting surfaces (12, 14) abut the cavity-facing surfaces (4, 6) continuously along the length of said loop (7), whereby said cavity-facing surfaces (4, 6) of the substrates (3, 5) and the loop (7) define the cavity (15). |
