发明名称 |
BONDED SEMICONDUCTOR SUBSTRATE INCLUDING A COOLING MECHANISM |
摘要 |
A bonded substrate comprising two semiconductor substrates is provided. Each semiconductor substrate includes semiconductor devices. At least one through substrate via is provided between the two semiconductor substrates to provide a signal path therebetween. The bottom sides of the two semiconductor substrate are bonded by at least one bonding material layer that contains a cooling mechanism. In one embodiment, the cooling mechanism is a cooling channel through which a cooling fluid flows to cool the bonded semiconductor substrate during the operation of the semiconductor devices in the bonded substrate. In another embodiment, the cooling mechanism is a conductive cooling fin with two end portions and a contiguous path therebetween. The cooling fin is connected to heat sinks to cool the bonded semiconductor substrate during the operation of the semiconductor devices in the bonded substrate. |
申请公布号 |
US2010155932(A1) |
申请公布日期 |
2010.06.24 |
申请号 |
US20080343528 |
申请日期 |
2008.12.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAMBINO JEFFREY P.;STAMPER ANTHONY K. |
分类号 |
H01L23/538;G06F17/50;H01L21/768;H01L23/34 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|