WIRING BOARD WITH LEAD PIN, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board with lead pin whose bonding strength is improved, and to provide a suitable manufacturing method of the board.

SOLUTION: In the wiring board with lead pin 70, the lead pin 20 is bonded to a connection pad 12 formed on the wiring board 10 through a conductive material 15a. A head 20b formed to be larger than an axis 20a is formed at one end of the axis in the lead pin 20. The head 20b is bonded to the connection pad 12 by the conductive material 15a. A face where the connection pad 12 of the wiring board 10 is formed is resin-sealed by a first resin 40 to be thicker than the head 20b except for a part to which the head 20b is bonded. A face side to which the axis 20a in the head 20b is connected is stuck to first resin 40 and is sealed by a second resin 42.

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