发明名称 |
SHIELD PLATE AND ELECTROPLATING APPARATUS |
摘要 |
PURPOSE: A shielding plate and an electrolytic plating device are provided to regularly the flow and concentration of plating liquid by reducing turbulence. CONSTITUTION: A shielding plate(50) comprises a plate and a plurality of holes. The plate blocks an electric force line in electroplating. The plate is a square-board. The plate is a photo frame shape. The opening is formed on the center of the plate. A plurality of holes is formed in the plate. A plurality of holes is a honeycomb shape. An electrolytic plating apparatus comprises a plating bath(10), a manifold(40), anodes, a cathode(30), a power supply unit(60), and a shielding plate.
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申请公布号 |
KR20100068737(A) |
申请公布日期 |
2010.06.24 |
申请号 |
KR20080127194 |
申请日期 |
2008.12.15 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOO, DAL HYUN;CHOI, CHANG HWAN;YOON, HEE SOO;PARK, CHANG HWAN;CHOI, YUNN HONG |
分类号 |
C25D17/00;C25D17/02 |
主分类号 |
C25D17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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