发明名称 SHIELD PLATE AND ELECTROPLATING APPARATUS
摘要 PURPOSE: A shielding plate and an electrolytic plating device are provided to regularly the flow and concentration of plating liquid by reducing turbulence. CONSTITUTION: A shielding plate(50) comprises a plate and a plurality of holes. The plate blocks an electric force line in electroplating. The plate is a square-board. The plate is a photo frame shape. The opening is formed on the center of the plate. A plurality of holes is formed in the plate. A plurality of holes is a honeycomb shape. An electrolytic plating apparatus comprises a plating bath(10), a manifold(40), anodes, a cathode(30), a power supply unit(60), and a shielding plate.
申请公布号 KR20100068737(A) 申请公布日期 2010.06.24
申请号 KR20080127194 申请日期 2008.12.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 YOO, DAL HYUN;CHOI, CHANG HWAN;YOON, HEE SOO;PARK, CHANG HWAN;CHOI, YUNN HONG
分类号 C25D17/00;C25D17/02 主分类号 C25D17/00
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