发明名称 SHEET FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION AND PROCESS FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE WITH THE SAME
摘要 The present invention provides a sheet (1) for optical-semiconductor-element encapsulation, which comprises: an outermost resin layer A (2) that is to be brought into contact with one or more optical semiconductor elements (6); a light-diffusing layer (3) formed on the layer A (2) and containing light-diffusing particles; and a resin layer B (4) formed on the light-diffusing layer (3) and having a lower refractive index than that of the layer A (2). Also disclosed is a process for producing an optical semiconductor device using the sheet (1).
申请公布号 KR20060054154(A) 申请公布日期 2006.05.22
申请号 KR20050108604 申请日期 2005.11.14
申请人 NITTO DENKO CORPORATION 发明人 HARADA NORIAKI;HOTTA YUJI;SUEHIRO ICHIRO;SADAYORI NAOKI
分类号 H01L21/52;H01L21/56;H01L33/32;H01L33/54 主分类号 H01L21/52
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