| 摘要 |
PURPOSE: A lapping carrier is provided to reduce scratches and damages on a wafer in the case of the escape of the wafer by preventing the warpage of the lapping carrier. CONSTITUTION: A polarity of wafer maintaining holes(60) is placed between the upper plate and the lower plate of a double-sided lapping device. A slurry hole(70) is arranged in the central part of a lapping carrier(50). A wafer is inserted into and held in the disk-shaped body of the lapping carrier. Additional slurry holes are arranged in each interval between two neighboring wafer maintaining holes.
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