| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having a high resolution from which a film having excellent bending performance and flame retardancy is obtained, a radiation-sensitive coverlay, and a flexible printed wiring board having a protective film obtained from the radiation-sensitive coverlay. <P>SOLUTION: The radiation-sensitive resin composition comprises (A) an acid-modified epoxy acrylate resin, (B) crosslinked polymer particles having carboxyl groups and hydroxyl groups and having a glass transition temperature of ≤0°C, (C) a phosphorus-containing polymerizable compound, (D) a photopolymerization initiator, and (E) a solvent. <P>COPYRIGHT: (C)2010,JPO&INPIT |
