| 摘要 |
PROBLEM TO BE SOLVED: To greatly extend the life of a joint part by lowering temperature at both ends of a Peltier element by suppressing thermal output from a semiconductor module, without reducing a total heat quantity generated from a temperature control module during heat exchange using the Peltier element. SOLUTION: The temperature control module has a structure in which at least a heat absorbing surface 1 and a heat dissipation surface 2 sandwich a thermoelectric conversion element 7 using Peltier element. A circuit 9 for applying a supply heat is wired to the heat dissipation surface. So, in addition to the heat generated from Peltier effect from the thermoelectric conversion element as well as Joule heat, the supply heat from the circuit can be applied to the heat dissipation surface. COPYRIGHT: (C)2010,JPO&INPIT |
