| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor element from having a defect owing to cutting with a blade. SOLUTION: A semiconductor substrate 100 is arranged on a dicing tape 200 having a laminate structure having a conductive layer 211 formed on a conductive layer 212 with an insulating layer 201b interposed, and the semiconductor substrate 100 and dicing tape 200 are diced to a cutting depth such that the conductive layer 211 becomes conductive and the conductive layer 212 becomes nonconductive. Through such dicing, the semiconductor element is suppressed from having the defect when the semiconductor substrate 100 is cut into individual pieces. COPYRIGHT: (C)2010,JPO&INPIT
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