A SEMICONDUCTOR DEVICE INCLUDING A REDUCED STRESS CONFIGURATION FOR METAL PILLARS

摘要

In a metallization system of a sophisticated semiconductor device, metal pillars 271 may be provided so as to exhibit an increased efficiency in distributing any mechanical stress exerted thereon. This may be accomplished by significantly increasing the surface area of the final passivation layer 260 that is in tight mechanical contact with the metal pillar, for example by providing an additional stress distribution element 272 in contact with the pillar 271 and the final passivation layer 260.