<p>The device (10) has a shaft (14) for receiving force to be measured. A meander-shaped spring (16.1) is fixed in a substrate fixing point (18.1) on a substrate (12) i.e. semiconductor substrate. The spring includes two sections, where each section is designed as an end section (20.1) and is fixed in a shaft fixing point (21.1) at the shaft. A capacitive sensor (24.1) detects a position of the end sections relative to the substrate. An electrostatic comb drive compensates the force to be measured. A path measuring device measures a change of position of the shaft relative to the substrate.</p>
申请公布号
EP2199769(A2)
申请公布日期
2010.06.23
申请号
EP20090015554
申请日期
2009.12.16
申请人
BUNDESREPUBLIK DEUTSCHLAND, VERTR. DURCH DAS BUNDESMINISTERIUM F. WIRTSCHAFT UND TECHNOLOGIE