发明名称 Printed circuit board with electronic components embedded therein and method for fabricating the same
摘要 <p>Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.</p>
申请公布号 KR100965339(B1) 申请公布日期 2010.06.22
申请号 KR20080052675 申请日期 2008.06.04
申请人 发明人
分类号 H05K1/18;H05K3/46 主分类号 H05K1/18
代理机构 代理人
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