| 摘要 |
<p>PURPOSE: A method for manufacturing a transponder unit and a manufacturing device thereof are provided to supply improved soldering by inducing a line conductor from a plane to an electrical part acceptance unit and forming a loop. CONSTITUTION: One or more receiving units(2) for electronic units(3) are provided to the area of a substrate(1). A line conductor(6) is induced to the substrate area. The line conductor is fixed on the substrate outside the receiving unit. The line conductor is used in the receiving unit from one side of the receiving unit. The line conductor forms a first loop(8). The line conductor is induced to be returned again from one side or the side(12) to the substrate.</p> |
