| 摘要 |
<p>PURPOSE: A semiconductor package and a method of manufacturing the same are provided to form antenna by using a plurality of conductive polarization particles, thereby reducing the manufacturing process of the antenna. CONSTITUTION: An antenna(120) is arranged on upper side of an electromagnetic wave blocking member(110). The antenna comprises an antenna unit and insulating unit. A plurality of conductive particles is electrically connected according to the member for shielding electric wave in the antenna unit. RFID chip ball lands(130) is arranged on the member for shielding electric wave. The RFID chip ball lands is electrically connected to the antenna unit. An RFID chip(140) is electrically connected to the RFID chip ball lands.</p> |
