METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to prevent the warpage of a semiconductor substrate by attaching a support plate on the upper side of a cylindrical electrode and a sealing film through an adhesive layer. CONSTITUTION: An insulating film is formed on a semiconductor wafer. A bump electrode for an external connection is formed on the insulating film. A sealing film(12) is formed around the bump electrode for the external connection. A support plate(24) is attached on the upper side of the bump electrode and the sealing film through an adhesive layer(23). A groove(28) is formed on the lower side of the semiconductor wafer. A resin protective layer(11) is formed on the lower side of the semiconductor wafer.