发明名称 METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR EPITAXIAL WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a compound semiconductor epitaxial wafer which can adjust a current gain by thermal treatment. SOLUTION: In the method of manufacturing a compound semiconductor epitaxial wafer, material gas is supplied on a heated substrate 1, and an epitaxial layer including a sub collector layer 2, a collector layer 3, a carbon-doped base layer 4, an emitter layer 5 and an emitter contact layer 6 is formed. Immediately after the emitter contact layer 6 is formed, thermal treatment is carried out. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010135580(A) 申请公布日期 2010.06.17
申请号 JP20080310601 申请日期 2008.12.05
申请人 HITACHI CABLE LTD 发明人 HIGASHITANI MASAHARU
分类号 H01L21/331;H01L21/205;H01L29/737 主分类号 H01L21/331
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