| 摘要 |
PROBLEM TO BE SOLVED: To suppress a wire-bonding pattern failure on a circuit board by removing a change in color of pattern of the circuit board after exfoliating a resist film. SOLUTION: The method for forming a circuit pattern includes steps of: exfoliating resist by dissolving the resist film on the circuit board after forming patterns by an exfoliating solution including dodecylbenzenesulfonic acid; surface activating the surface of a substrate by cyanide sodium after alcohol-defatting the substrate after the resist exfoliation step; and cleaning the circuit board with its surface activated by the surface activation step. COPYRIGHT: (C)2010,JPO&INPIT
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