摘要 |
An LED illuminating device includes an optical section at a bottom end thereof, an electrical section at a top end thereof and a heat dissipation section between the optical section and the electrical section. The optical section includes an LED emitter. The electrical section electrically connects with the LED emitter. The heat dissipation section includes an upper substrate, a lower substrate being parallel to and spaced from the upper substrate, a plurality of fins arranged between the upper and lower substrates and a heat pipe. The heat pipe includes an evaporating section connected to the lower substrate and a condensing section connected to the upper substrate. The LED emitter is attached to the lower substrate and thermally connects therewith. The heat pipe is transfers heat of the LED emitter from the lower substrate to the upper substrate.
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