发明名称 |
COPOLYMER AND PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copolymer useful as a photosensitive resin having excellent adhesivity to substrates and forming patterns having high sensitivity and high resolution. <P>SOLUTION: The copolymer is obtained by polymerizing a monomer mixture comprising at least a vinyl monomer containing a plurality of carbon-carbon double bonds in the molecule [except a (meth) acrylate derivative and a (meth)acrylamide derivative] (vinyl monomer A) and a carboxy group- or carboxylic acid anhydride group-containing vinyl monomer (vinyl monomer B). The vinyl monomer A includes a compound represented by formula (1) (wherein R<SP>1</SP>is hydrogen or hydrocarbon that may contain a substituent; R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>may be the same as or different from each other and are each hydrogen or methyl; X is connecting group; and n is an integer of 1-3). <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010132804(A) |
申请公布日期 |
2010.06.17 |
申请号 |
JP20080311097 |
申请日期 |
2008.12.05 |
申请人 |
DAICEL CHEM IND LTD |
发明人 |
NIJUKKEN TOSHIHIKO;MIMURA KENICHIRO |
分类号 |
C08F220/06;C08F212/08;C08F220/32;C08F222/04;C08F230/08;G02B5/20;G03F7/004;G03F7/038 |
主分类号 |
C08F220/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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