| 摘要 |
PROBLEM TO BE SOLVED: To allow devices to be provided with ID marks, without causing reduction in the bending strength of the devices. SOLUTION: A wafer processing method includes at least a rear surface grinding step of grinding a rear surface W2 of a wafer W, on which devices D each having a protruding electrode on its surface are formed and delimited by splitting lines S; a frame supporting step of attaching a dicing tape T onto the rear surface W2 of the wafer W and attaching a frame F onto the dicing tape T so as to support the wafer W by using the frame F; a splitting step of splitting the wafer W into individual devices D; and a pickup step of picking up each device D from the dicing tape T. The steps are also performed, after the rear surface grinding step and before the pickup step which include: transfer of ID mark labels 4 provided to the dicing tape T; laser irradiation to an adhesive layer of the dicing tape T; and ID mark fixing, by printing ID marks on the rear surfaces of the devices D by means of an ink jet system or the like. COPYRIGHT: (C)2010,JPO&INPIT |
