| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board capable of easily forming an electric circuit with high precision on an insulating substrate. SOLUTION: The method of manufacturing a circuit board includes a coating forming step of forming a resin coating 2 on a surface of an insulating substrate 1, a circuit pattern forming step of forming a circuit pattern part, such as a circuit groove 3, by forming a recess having a depth greater than the thickness of the resin coating with an outer surface of the resin coating 2 as a reference, a catalyst depositing step of depositing a plating catalyst or a precursor 5 thereof on the surface of the circuit groove 3 and on the surface of the resin coating 2, a coating removing step of removing the resin coating 2 from the insulating substrate 1, and a plating processing step of forming an electroless plating film only in the region where the plating catalyst or the precursor 5 thereof after the resin coating 2 is removed remains. COPYRIGHT: (C)2010,JPO&INPIT |
