| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal conductive thermosetting resin composition having viscosity in molding suppressed to a low value, hardly causing deterioration in excellent various properties such as heat resistance and mechanical strength inherent in a thermosetting epoxy resin and having excellent thermal conductivity while covering the defects such as low toughness or low crack resistance inherent in the epoxy resin. Ž<P>SOLUTION: The high thermal conductivity thermosetting resin composition contains the thermosetting epoxy resin (A), a thermosetting resin except the thermosetting epoxy resin (A) or a thermoplastic resin (B) and a high thermal conductivity inorganic filler (C), wherein at least thermosetting epoxy resin (A) forms a continuous phase. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
