| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated ceramic electronic component, which includes a process which obtains a laminate by supplying a mother ceramic green sheet supported by a carrier film and laminating the same highly accurately using a transfer/pressure bonding method for the mother ceramic green sheet. SOLUTION: The manufacturing method of the laminated ceramic electronic component includes a process wherein the mother ceramic green sheet 1, supported by the carrier film 2, is bonded by pressure to the outer peripheral surface of the first retaining roll 7 from the side of the mother ceramic green sheet 1 and only the mother ceramic green sheet 1 retained by the retaining roll 7 is laminated on the outer peripheral surface of the laminated roll 11 as a lamination stage after peeling the carrier film 2. COPYRIGHT: (C)2010,JPO&INPIT
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