| 摘要 |
<p>An IC device (10) is constructed in a manner that allows for the memory (12), (13) and processor elements (11), (14) to be positioned one above the other on parallel planes of a 3-D structure. Interconnections (31), (32), (33) between the memory (s) and the processor (s) are accomplished by using through substrate stacking (TSS) techniques. This arrangement provides the processor with direct access to the memory by reducing the distance between the memory and the processor.</p> |
