发明名称 SUBSTRATE PLASMA TREATMENT USING MAGNETIC MASK DEVICE
摘要 Plasma treatment apparatus and method for treatment of a surface of a substrate. A dielectric barrier discharge electrode structure is provided having a treatment space (5) and comprising a first electrode (2) and a second electrode (3), and a power supply (11) connected to the first electrode (2) and the second electrode (3) for generating an atmospheric pressure plasma in the treatment space (5). The plasma treatment apparatus further comprises a magnetic layer (6) provided on a surface of at least the first electrode (2). The first electrode (2) is arranged to receive, in operation, the substrate (1) to be treated and a mask device (7) in contact with the substrate (1), the mask device (7) interacting with the magnetic layer (6).
申请公布号 US2010147794(A1) 申请公布日期 2010.06.17
申请号 US20080526944 申请日期 2008.02.01
申请人 FUJIFILM MANUFACTURING EUROPE B.V. 发明人 DE VRIES HINDRIK WILLEM;KORNGOLD BRUNO ALEXANDER
分类号 B44C1/22;C23C16/503;C23C16/54;C23F1/08 主分类号 B44C1/22
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