发明名称 |
Method for manufacturing capacitor embedded in PCB |
摘要 |
A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.
|
申请公布号 |
US7736397(B2) |
申请公布日期 |
2010.06.15 |
申请号 |
US20070730979 |
申请日期 |
2007.04.05 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE SEUNG EUN;CHUNG YUL KYO;KANG HYUNG DONG;JIN HYUN JU |
分类号 |
H01L21/8242;H01G9/00 |
主分类号 |
H01L21/8242 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|