发明名称 Anisotropic conductive adhesive
摘要 An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive/insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.
申请公布号 US7736541(B2) 申请公布日期 2010.06.15
申请号 US20060992790 申请日期 2006.09.26
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 TOSHIOKA HIDEAKI;YAMAMOTO MASAMICHI
分类号 H01B1/00;H01B1/20;H01B1/22 主分类号 H01B1/00
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