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经营范围
发明名称
Mold for manufacturing semiconductor package and method for molding using the same
摘要
申请公布号
KR100963151(B1)
申请公布日期
2010.06.15
申请号
KR20070139547
申请日期
2007.12.28
申请人
发明人
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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