发明名称 |
Structure and method of forming electrically blown metal fuses for integrated circuits |
摘要 |
A fuse structure for an integrated circuit device includes an elongated metal interconnect layer defined within an insulating layer; a metal cap layer formed on only a portion of a top surface of the metal interconnect layer; and a dielectric cap layer formed on both the metal cap layer and the remaining portions of the metal interconnect layer not having the metal cap layer formed thereon; wherein the remaining portions of the metal interconnect layer not having the metal cap layer formed thereon are susceptible to an electromigration failure mechanism so as to facilitate programming of the fuse structure by application of electric current through the elongated metal interconnect layer.
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申请公布号 |
US7737528(B2) |
申请公布日期 |
2010.06.15 |
申请号 |
US20080132337 |
申请日期 |
2008.06.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BONILLA GRISELDA;CHANDA KAUSHIK;FILIPPI RONALD G.;GAMBINO JEFFREY P.;GRUNOW STEPHAN;HU CHAO-KUN;SANKARAN SUJATHA;SIMON ANDREW H.;STANDAERT THEODORUS E. |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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