发明名称 |
Multilayer substrate including components therein |
摘要 |
Components having different heights are installed in a multilayer substrate using a metal core layer formed by bonding a plurality of metal layers. The metal core layer includes through-holes and a spot-faced portion. Passive components and an active component are disposed in the through-holes and the spot-faced portion, respectively. These components are connected to conductive patterns formed on wiring layers, with connecting vias therebetween. Contact faces of each component with the connecting vias are controlled so as to be disposed at the same level with the metal layers.
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申请公布号 |
US7738256(B2) |
申请公布日期 |
2010.06.15 |
申请号 |
US20080108303 |
申请日期 |
2008.04.23 |
申请人 |
TAIYO YUDEN CO., LTD |
发明人 |
SAWATARI TATSURO;MIYAZAKI MASASHI |
分类号 |
H05K1/18;H05K3/46;B32B3/00;B32B15/08;H01L23/14;H01L23/538;H05K1/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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