METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

A method for producing a semiconductor chip with an adhesive film has a step for preparing a laminate wherein a semiconductor wafer, an adhesive film for semiconductor and a dicing tape are laminated in this order. The adhesive film for semiconductor has a thickness in the range of 1-15 μm, and a tensile fracture elongation of less than 5% which is less than 110% of elongation at the time of maximum load. The semiconductor wafer has a reformed portion which is formed by irradiating the semiconductor wafer with a laser beam for dividing the semiconductor wafer into a plurality of semiconductor chips. The method also has a step for dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film for semiconductor by stretching the dicing tape in the direction for separating the plurality of semiconductor chips from each other, and a step for dividing the adhesive film for semiconductor by picking up the plurality of semiconductor chips in the laminating direction of each laminate and obtaining a semiconductor chip with an adhesive film.