| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a semiconductor device for suppressing the generation of wastes in dicing due to the peeling of a process mark. <P>SOLUTION: In a semiconductor device 12, a scribe line region 14 is formed in the circumference of a semiconductor element region 20 where a ring-like equipotential ring 22 is formed. A process mark 24 is formed in the semiconductor element region 20 outside the equipotential ring 22. The process mark that has been conventionally formed in the scribe line region is formed in the semiconductor region. The process mark 24 is not cut in dicing, so it does not peel off. <P>COPYRIGHT: (C)2010,JPO&INPIT |
