| 摘要 |
PROBLEM TO BE SOLVED: To inspect the conditions of side faces in a chip component held by chucking with a chucking nozzle not to charge defective chips before charging the chip component into each accommodating groove of a carrier tape. SOLUTION: A bottom face of the chip component AA held by chucking with a chucking charge nozzle 38 is irradiated with illuminating light from a coaxial illuminating lamp 61 whose half amount is reflected and raised with a beam splitter 62, and a reflected image from the bottom face of the chip component AA is reflected with the beam splitter 62, and is picturized through a zoom lens 68, the side of the chip component AA is uniformly irradiated with the illuminating light from a dome illuminating lamp 65 whose half amount is transmitted by each slanted surface 66A likewise and the reflected image from the side of the chip component AA is reflected downwardly with a slanted surface 66A, reflected with the beam splitter 62, and picturized through the lens 68, and a recognition processor performs a recognition processing to inspect the conditions of each side AA in the chip component AA based on the image. COPYRIGHT: (C)2010,JPO&INPIT
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