发明名称 |
Printed circuit board comprising metal bump and method of manufacturing the same |
摘要 |
Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer.
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申请公布号 |
US2010139969(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20090379480 |
申请日期 |
2009.02.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
AN JIN YONG;KIM KI HWAN |
分类号 |
H05K1/11;B05D5/12;H05K3/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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