| 摘要 |
Semiconductor device 1 according to the present invention includes wiring board 8 having mounting surface 8a mounted with laminated semiconductor chips 2 and plural semiconductor chips 2 mounted on mounting surface 8a of wiring board 8. Plural semiconductor chips 2 mounted on mounting surface 8a of wiring board 8 include second semiconductor chips 2b with circuit formation surfaces 3 directed to the mounting surface 8a side of wiring board 8 and first semiconductor chips 2a with circuit formation surfaces 3 directed to the opposite side of the mounting surface 8a side of wiring board 8.
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