| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board, capable of preventing corrosion of plating of through-holes even for the printed circuit board having small-diameter through-holes. Ž<P>SOLUTION: The method includes: the steps of atomizing a charged solder resist ink 15 and coating the ink from the front surface of the printed circuit board 11 having through-holes, and blowing an air 18 to the printed circuit board 11 from the back surface of the printed circuit board 11. In the method, a spray gun 14 for jetting the solder resist ink 15 and an air nozzle 17 for blowing the air 18 synchronously moves up and down. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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