| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can improve productivity and can also enhance a yield, related to the method for manufacturing the semiconductor device equipped with a heat radiation support member which radiates heat generated from a semiconductor chip while being provided in a penetrating portion penetrating a sheet-like insulation base material. <P>SOLUTION: After arranging an insulation base material 55 with a wiring pattern 29 and a metal mother member 58 between a lower metal mold 61 in contact with the lower face 55B of the insulation base material 55 and an upper metal mold 62 having a protruding portion 64 inserted into a penetrating portion 33 in contact with the metal mother member 58 and a salient 66 formed in the protruding portion 64 of a portion in contact with the metal mother member 58, the upper metal mold 62 is compressed until the metal mother member 58 is sandwiched between the protruding portion 64 in which the salient 66 is formed and the lower metal mold 61, and a part of the metal mother member 58 formed between the protruding portion 64 and the lower metal mold 61 is crushed and extended to form a heat radiation support member 28. <P>COPYRIGHT: (C)2010,JPO&INPIT |
