发明名称 |
INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS |
摘要 |
An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.
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申请公布号 |
US2010139966(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20100702439 |
申请日期 |
2010.02.09 |
申请人 |
FOXCONN ADVANCED TECHNOLOGY INC. |
发明人 |
YANG CHIH-KANG;LIN CHENG-HSIEN |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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