SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to increase the number of the input/output terminals of the semiconductor package regardless of the size of the package by forming an upper land on the upper side of the semiconductor package using a carrier in which a circuit pattern is formed. CONSTITUTION: A substrate(10) includes a plurality of conductive patterns on the upper side. A first semiconductor die(20) is formed on the upper side of the substrate. An upper solder ball(40) is electrically connected to the conductive pattern. The upper land(50) is formed on the upper side of the first semiconductor die and the upper side of the solder ball. The upper land is electrically connected with the upper side of the solder ball. An encapsulant(60) is formed on the upper side of the substrate.