| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component housing package exhausting air existing in the package to the outside in a short period of time in an exhausting process during manufacture without deteriorating its quality, and also to provide an electronic apparatus, and a method of manufacturing the same. SOLUTION: In this electronic component housing package 3 including: a substrate 32 provided with a mounting part 31 to mount an electronic component 2; and a frame body 33 provided so as to surround the mounting part 31, a support part 34 to support a lid body 35 for covering the mounting part 31 (electronic component 2) is provided on the frame body 33, the width of the support part 34 in the thickness direction T of the frame body 33 is made narrower as it goes toward the lid part 35, a jointing material 36 is interposed in an air gap portion between the support part 34 and the lid body 35, and the support part 34 is thereby joined to the lid part 35. COPYRIGHT: (C)2010,JPO&INPIT
|
