| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device with reduced poor connections by uniformizing alloy growth between lands and bumps in all of the lands. <P>SOLUTION: The electronic device includes a wiring board 2 having one surface 2a covered with an insulation film with a plurality of openings 10, and the lands 3 provided on regions exposed from the openings 10 on the surface 2a of the wiring board 2. Areas of the openings 10 are all formed in approximately equal areas. A volume of the lands 3 provided out of a specific region on the surface 2a of the wiring board 2 is structured to be larger than that of the lands 3 provided in the specific region on the surface 2a of the wiring board 2. An area other than the specific region is such an area that more heat is applied than the inside of the specific region. <P>COPYRIGHT: (C)2010,JPO&INPIT |
